The following is about Rigid PCB related, I hope to help you better understand Multilayer pcb 100% tested working computer pcb Motherboard with BGA High density.
Multilayer pcb 100% tested working computer pcb Motherboard with BGA High density
if have Gerber file or enquire. please email is violet(at)akesoncircuit(dot)com(dot)cn
Deliverables
1/Quotes in 24 hours or less
2/Standard production leadtime of 20 working days (4 weeks)
3/Prototype leadtime of 5 to 10 working days (1-2 weeks)
4/Stack-ups and impedance simulation in 36 hours
5/Initial response to technical questions or quality concerns in 36 hours
6/DFM and EQ's prior to PO placement upon request
Quality system
1/Akeson has mature and stringent Q
2/100% AOI, 100% ET, 100% FQC + FQA
3/SPC and Cpk programs
4/Lean Manufacturing and 6S programs
5/Advanced inspection and lab equipment
6/Standard QA report with every shipment
7/RoHS and REACH Compliance
8/Conflict Minerals Compliance
Detailed Product Description
Multilayer pcb
1) Layer:10
2) Board finished thickness: 1.6mm
3) Material: FR-4
4) Min. drilled hole size: 0.3mm
5) Min. Line width: 0.1mm
6) Min.Line spacing: 0.1mm
7) Surface finish/treatment :HASL
8) Copper thickness: 1 OZ
10) Solder mask color: blue
11) Copper thickness in hole: >25.0 um (>1mil)
12)Inner packing: Vacuum packing / Plastic bag
Outer packing: Standard carton packing
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|
Quickly |
Sample(Normal) |
Mass(Normal) |
|
Single-sided: |
1-2 days |
3-5 days |
7-8 days |
|
Double-sided: |
2-3 days |
5-8 days |
8-10 days |
|
4 Layers: |
3-4 days |
8-10 days |
10-12 days |
|
6 Layers: |
5-6 days |
10-12 days |
12-14 days |
|
8 Layers: |
6-8 days |
10-12 days |
14-16 days |
|
10 Layers: |
8-10 days |
12-14 days |
16-18 days |
|
12 Layers: |
10 days |
14-16 days |
16-18 days |
|
>14 Layers: |
>=10 days |
>=16 days |
>=16 days |
U.S.UL product ceftification,PCB E354170 PCB;
ISO 90012008
ISO/TS 16949
QuaIity assurance standards lPC-A-600 HlPC-6011l PC-6012 BlPC-D-300 ANSl-UL-796
AnaIysis CapabiIity
In-House(Lab)
Follow the lPC-TM-650 for test function Follow the lPC-TM-650 for test function
PeeIable strength test for copper foil
Metal thickness
Flash Gold sliding pad roughness test
Solder Mask Gloss Level test
Cross section
SoIderability & Thermal shock test
Lead-free reflow simulation test(up to 280C)
Additional test can be tested at GF
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