Product Description

Electronics PCD Assembly PCDA Board

We can provde many kinds of PCB(1-30 layers), FPC(1-8 layers) and regid-flex boards(1-6 layers).and all PCBA production.

Our production capality for regid board:

Surface treatment: OSP/ENTEK, HASL leadfree, Flash Gold,Immersion NI/AU, Immersion sliver,Immersion Ti, HASL leadfree+Plating Hard/Flex gold, Immersion Au+Gold fingers,

Material: FR4,CEM1,CEM3, High Tg , halogen free,Rogers ,Al based meaterial and so on;

Material supplier: SY, KB.Nan Yan. IETQ, Grace, Mitsui,RogersRF, Berguist

Board thickness: 0.2-6mm;

Copper copper: 1/3-5OZ;

Min trace width/space: 0.075/0.075mm;

Min Hole diameter: 0.2mm ( Normal PCB)

We can also supply PCBA,FPCA and SMT service, we have five automatic SMT production Lines.If you have require them. we can do my best price and high-quality produciton for you.

Thanks.

Any questiosn. Please contact us:

violet at akesoncircuit.com.cn

	Quickly	Sample(Normal)	Mass(Normal)
Single-sided:	1-2 days	3-5 days	7-8 days
Double-sided:	2-3 days	5-8 days	8-10 days
4 Layers:	3-4 days	8-10 days	10-12 days
6 Layers:	5-6 days	10-12 days	12-14 days
8 Layers:	6-8 days	10-12 days	14-16 days
10 Layers:	8-10 days	12-14 days	16-18 days
12 Layers:	10 days	14-16 days	16-18 days
>14 Layers:	>=10 days	>=16 days	>=16 days

Note:Specially Board Regards document specific request

U.S.UL product ceftification，PCB E354170 PCB;
ISO 90012008
ISO/TS 16949
QuaIity assurance standards lPC-A-600 HlPC-6011l PC-6012 BlPC-D-300 ANSl-UL-796
AnaIysis CapabiIity
In-House(Lab)
Follow the lPC-TM-650 for test function Follow the lPC-TM-650 for test function
PeeIable strength test for copper foil
Metal thickness
Flash Gold sliding pad roughness test
Solder Mask Gloss Level test
Cross section
SoIderability & Thermal shock test
Lead-free reflow simulation test(up to 280C）
Additional test can be tested at GF
authorized lab