Product Description

FPC Flexible Printed Circuit Board PCB Manufacturers

Specifications

FPC Polyimide Chemical nickel/gold
1, fast leadtime for sample and mass production.
2, small order quatity accept
3, strict quality control
4, reasonable price

FPC Production Capacity
ITEM	Flexible PCB FPC Board
Layers	1-6 Layers
Mini thickness	0.08mm
Min.Line Width	0.05mm
Min.Hole Size	0.15mm PTH
Min. PTH Hole Ring	0.45mm
Min. Gap between Cover Layer and Pad	0.1mm
Min. Gap between Trace and Outline	0.2mm
Trace Width Tolerance	±0.03mm W±30%
Outline Tolerance	±0.05mm L≤25mm
Hole Size Tolerance	±0.05mm
Stiffener and Outline Tolerance	±0.1mm
Surface Treatment	ENIG,Gold Plating,HAL,Plating Pb-Sn

Quickly Sample (Normal) Mass (Normal)

Single-sided: 1days 3-5 days 7-8 days

Double-sided: 2 days 5-8 days 8-10 days

4 Layers : 3 days 8-10 days 10-12 days

6 Layers: 6days 10-12 days 12-14 days

8 Layers: 8 days 10-12 days 14-16 days

10 layers: 8-10 days 12-14 days 16-18days

12 Layers: 10 days 14-16 days 16-18days

>14 Layers: >=10 days >=16 days >=20days

	Quickly	Sample(Normal)	Mass(Normal)
Single-sided:	1-2 days	3-5 days	7-8 days
Double-sided:	2-3 days	5-8 days	8-10 days
4 Layers:	3-4 days	8-10 days	10-12 days
6 Layers:	5-6 days	10-12 days	12-14 days
8 Layers:	6-8 days	10-12 days	14-16 days
10 Layers:	8-10 days	12-14 days	16-18 days
12 Layers:	10 days	14-16 days	16-18 days
>14 Layers:	>=10 days	>=16 days	>=16 days

Note:Specially Board Regards document specific request

U.S.UL product ceftification，PCB E354170 PCB;
ISO 90012008
ISO/TS 16949
QuaIity assurance standards lPC-A-600 HlPC-6011l PC-6012 BlPC-D-300 ANSl-UL-796
AnaIysis CapabiIity
In-House(Lab)
Follow the lPC-TM-650 for test function Follow the lPC-TM-650 for test function
PeeIable strength test for copper foil
Metal thickness
Flash Gold sliding pad roughness test
Solder Mask Gloss Level test
Cross section
SoIderability & Thermal shock test
Lead-free reflow simulation test(up to 280C）
Additional test can be tested at GF
authorized lab