Product Description

Power bank pcb board

Detailed Product Description:

PCB

1) Layer: 2 layer pcb

2) Board finished thickness: 1.6mm

3) Material: FR-4

4) Min. drilled hole size: 0.4mm

5) Min. Line width: 6mil (0.15mm)

6) Min.Line spacing: 6mil (0.15mm)

7) Surface finish/treatment: Immersion gold

8) Copper thickness: 1 OZ

10) Solder mask color: Green

11)Inner packing: Vacuum packing / Plastic bag

Outer packing: Standard carton packing

12) Sample or mass produce, 5 to 8 days lead time

13) OEM/ODM is acceptable

Reference - Our Production Capability for Multilayer PCB/Rigid borad

Item	M-
Layer count	1-30 layers
Material	FR4(High TG, Halogen Free, high frequency), CEM1, CEM3,BT,Al base mateiral,and so on. Supplier: SY,KB,ITEQ,Isola,Nelco,Rogers,Grance,Mitsui
Maxpanel size	32±20(800mm±508mm)
Min width/space(min)	4mil/4mil
Max copper weight	140um(4oz) for inner layer 175um(5oz) for outer layer
Min machine drill size	0.2mm(8mil)
Via hole tpye	Blind/Burried/plugged
Thickness of finished board	0.20-6.0mm
Tolerance	Registration of innerlayer to of innerlayer:±3mil Accuracy of hole position:±2mil Tolerance of dilled slot:±3mil Tolerance of PTH diameter:±3mil Tolerance of NPTH diameter:±2mil PTH hole copper thichness: 0.4-2mil Image to image tolerance:±3mil Tolerance of etching:±1mil Solder mask registration tolerance: ±2mil Finished board : Thickness<=1.0mm: +/-0.1mm Thickness>0.1mm:+/-10% Outline router: +/-0.1mm Outline Score: +/-0.2mm
Color of solder mask	Green, Black, Blue,Red, White and so on
Surface freatment	HASL,HASL Lead Free,OSP ,Immersion Gold, Immersion Ti, Immersion Sliver, Flash gold, Selective Gold plating(gold thicness up to 120u),Gold figers ,Carbon print, Peelabe Mask
Hardness of solder solder	>=6H
Outline finished	CNC, V-CUT, Punching
Peel strength of line	≥61B/in
Warp and twist	≤0.7%