Product Description

Panel Mount PCB Connector

CBA capabilities:
• SMT assembly including BGA assembly
• Accepted SMD chips: 01005, BGA, QFP, QFN, TSOP
• Component height: 0.2-25mm
• Min packing: 0201
• Min distance among BGA : 0.25-2.0mm
• Min BGA size: 0.1-0.63mm
• Min QFP space: 0.35mm
• Min assembly size: (X*Y): 50*30mm
• Max assembly size: (X*Y): 350*550mm
• Pick-placement precision: ±0.01mm
• Placement capability: 0805, 0603, 0402, 0201
• High pin count press fit available
• SMT capacity per day: 800,000 point

DIP capability:
• A-8 of semi-assembly work line with 3 sets wave soldering machines
• B-4 of high/low-temperature burn-in test ovens for the burn-in tested required products
• All products are 100% inspected and tested during the DIP process

if have Gerber file and bom list. please send violet at akesoncircuit.com.cn

Reference - Our Production Capability for Multilayer PCB/Rigid borad

	Quickly	Sample(Normal)	Mass(Normal)
Single-sided:	1-2 days	3-5 days	7-8 days
Double-sided:	2-3 days	5-8 days	8-10 days
4 Layers:	3-4 days	8-10 days	10-12 days
6 Layers:	5-6 days	10-12 days	12-14 days
8 Layers:	6-8 days	10-12 days	14-16 days
10 Layers:	8-10 days	12-14 days	16-18 days
12 Layers:	10 days	14-16 days	16-18 days
>14 Layers:	>=10 days	>=16 days	>=16 days

Note:Specially Board Regards document specific request

U.S.UL product ceftification，PCB E354170 PCB;
ISO 90012008
ISO/TS 16949
QuaIity assurance standards lPC-A-600 HlPC-6011l PC-6012 BlPC-D-300 ANSl-UL-796
AnaIysis CapabiIity
In-House(Lab)
Follow the lPC-TM-650 for test function Follow the lPC-TM-650 for test function
PeeIable strength test for copper foil
Metal thickness
Flash Gold sliding pad roughness test
Solder Mask Gloss Level test
Cross section
SoIderability & Thermal shock test
Lead-free reflow simulation test(up to 280C）
Additional test can be tested at GF
authorized lab

PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba

Item	M-
Layer count	1-30 layers
Material	FR4(High TG, Halogen Free, high frequency), CEM1, CEM3,BT,Al base mateiral,and so on. Supplier: SY,KB,ITEQ,Isola,Nelco,Rogers,Grance,Mitsui
Maxpanel size	32±20(800mm±508mm)
Min width/space(min)	4mil/4mil
Max copper weight	140um(4oz) for inner layer 175um(5oz) for outer layer
Min machine drill size	0.2mm(8mil)
Via hole tpye	Blind/Burried/plugged
Thickness of finished board	0.20-6.0mm
Tolerance	Registration of innerlayer to of innerlayer:±3mil Accuracy of hole position:±2mil Tolerance of dilled slot:±3mil Tolerance of PTH diameter:±3mil Tolerance of NPTH diameter:±2mil PTH hole copper thichness: 0.4-2mil Image to image tolerance:±3mil Tolerance of etching:±1mil Solder mask registration tolerance: ±2mil Finished board : Thickness<=1.0mm: +/-0.1mm Thickness>0.1mm:+/-10% Outline router: +/-0.1mm Outline Score: +/-0.2mm
Color of solder mask	Green, Black, Blue,Red, White and so on
Surface freatment	HASL,HASL Lead Free,OSP ,Immersion Gold, Immersion Ti, Immersion Sliver, Flash gold, Selective Gold plating(gold thicness up to 120u),Gold figers ,Carbon print, Peelabe Mask
Hardness of solder solder	>=6H
Outline finished	CNC, V-CUT, Punching
Peel strength of line	≥61B/in
Warp and twist	≤0.7%