The following is about PCB Assembly for Industrial Products related, I hope to help you better understand PCB Assembly for Industrial Products.
PCB Assembly for Industrial Products
if have GERBER file. please send to violet(at)akesoncircuit(dot)com(dot)cn
we will do our best to service for your company.
PCBA
1) Layer:4
2) Board finished thickness: 2.0mm
3) Material: FR-4
4) Min. drilled hole size: 0.35mm
5) Min. Line width: 7mil (0.175mm)
6) Min.Line spacing: 7mil (0.175mm)
7) Surface finish/treatment :Immersion gold
8) Copper thickness: 1OZ
10) Solder mask color: Green
11)Inner packing: Vacuum packing / Plastic bag
Outer packing: Standard carton packing
Deliverables
1/Quotes in 24 hours or less
2/Standard production leadtime of 20 working days (4 weeks)
3/Prototype leadtime of 5 to 10 working days (1-2 weeks)
4/Stack-ups and impedance simulation in 36 hours
5/Initial response to technical questions or quality concerns in 36 hours
6/DFM and EQ's prior to PO placement upon request
Quality system
1/Sunshine has mature and stringent Q
2/100% AOI, 100% ET, 100% FQC + FQA
3/SPC and Cpk programs
4/Lean Manufacturing and 6S programs
5/Advanced inspection and lab equipment
6/Standard QA report with every shipment
7/RoHS and REACH Compliance
8/Conflict Minerals Compliance
|
Quickly |
Sample(Normal) |
Mass(Normal) |
Single-sided: |
1-2 days |
3-5 days |
7-8 days |
Double-sided: |
2-3 days |
5-8 days |
8-10 days |
4 Layers: |
3-4 days |
8-10 days |
10-12 days |
6 Layers: |
5-6 days |
10-12 days |
12-14 days |
8 Layers: |
6-8 days |
10-12 days |
14-16 days |
10 Layers: |
8-10 days |
12-14 days |
16-18 days |
12 Layers: |
10 days |
14-16 days |
16-18 days |
>14 Layers: |
>=10 days |
>=16 days |
>=16 days |
U.S.UL product ceftification,PCB E354170 PCB;
ISO 90012008
ISO/TS 16949
QuaIity assurance standards lPC-A-600 HlPC-6011l PC-6012 BlPC-D-300 ANSl-UL-796
AnaIysis CapabiIity
In-House(Lab)
Follow the lPC-TM-650 for test function Follow the lPC-TM-650 for test function
PeeIable strength test for copper foil
Metal thickness
Flash Gold sliding pad roughness test
Solder Mask Gloss Level test
Cross section
SoIderability & Thermal shock test
Lead-free reflow simulation test(up to 280C)
Additional test can be tested at GF
authorized lab