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PCBA Assembly OEM Manufacturing Shenzhen PCBA with One Stop PCBA
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PCBA Assembly OEM Manufacturing Shenzhen PCBA with One Stop PCBA

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Product Description

China PCBA Assembly OEM Manufacturing Shenzhen PCBA with One Stop PCBA Service

if have Gerber file and bom list. please send violet(@)akesoncircuit.com.cn

 

Printed circuit board

 

1) Layer:6 layer pcb board

2) Board finished thickness: 2.0mm

3) Material: FR-4

4) Min. drilled hole size: 0.4mm

5) Min. Line width:  7mil (0.175mm)

6) Min.Line spacing: 7mil (0.175mm)

7) Surface finish/treatment :Immersion gold

8) Copper thickness: 1 OZ

10) Solder mask color: Green

11)Inner packing: Vacuum packing / Plastic bag

     Outer packing: Standard carton packing

PCBA capabilities:
• SMT assembly including BGA assembly
• Accepted SMD chips: 01005, BGA, QFP, QFN and TSOP
• Component height: 0.2-25mm
• Minimum Packing: 0201
• Minimum distance among BGA: 0.25-2.0mm
• Minimum BGA size: 0.1-0.63mm
• Minimum QFP space: 0.35mm
• Minimum assembly size: (X) 50 * (Y) 30mm
• Maximum assembly size: (X) 350 * (Y) 550mm
• Pick-placement precision: ±0.01mm
• Placement capability: 0805, 0603, 0402 and 0201
• High pin count press fit available
• SMT capacity per day: 800,000 point
 
DIP capability:
• A-8 of semi-assembly work line with 3 set wave soldering machines
• B-4 of high/low-temperature burn-in test ovens for the burn-in tested required products
• All products are 100% inspected and tested during the DIP processPCBA capabilities:
• SMT assembly including BGA assembly
• Accepted SMD chips: 01005, BGA, QFP, QFN and TSOP
• Component height: 0.2-25mm
• Minimum Packing: 0201
• Minimum distance among BGA: 0.25-2.0mm
• Minimum BGA size: 0.1-0.63mm
• Minimum QFP space: 0.35mm
• Minimum assembly size: (X) 50 * (Y) 30mm
• Maximum assembly size: (X) 350 * (Y) 550mm
• Pick-placement precision: ±0.01mm
• Placement capability: 0805, 0603, 0402 and 0201
• High pin count press fit available
• SMT capacity per day: 800,000 point
 
DIP capability:
• A-8 of semi-assembly work line with 3 set wave soldering machines
• B-4 of high/low-temperature burn-in test ovens for the burn-in tested required products
• All products are 100% inspected and tested during the DIP process


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