PCBA/PCB assembly/panel mount PCB connector

PCBA/PCB assembly/panel mount PCB connector

 CBA capabilities:
• SMT assembly including BGA assembly
• Accepted SMD chips: 01005, BGA, QFP, QFN, TSOP
• Component height: 0.2-25mm
• Min packing: 0201
• Min distance among BGA : 0.25-2.0mm
• Min BGA size: 0.1-0.63mm
• Min QFP space: 0.35mm
• Min assembly size: (X*Y): 50*30mm
• Max assembly size: (X*Y): 350*550mm
• Pick-placement precision: ±0.01mm
• Placement capability: 0805, 0603, 0402, 0201
• High pin count press fit available
• SMT capacity per day: 800,000 point
 
DIP capability:
• A-8 of semi-assembly work line with 3 sets wave soldering machines
• B-4 of high/low-temperature burn-in test ovens for the burn-in tested required products
• All products are 100% inspected and tested during the DIP process
 

if have Gerber file and bom list. please send violet at akesoncircuit.com.cn

Reference - Our Production Capability for Multilayer PCB/Rigid borad