Product Description

PCB for LED Aluminum Heights Round Lamp Ring Lamp

LED Circuit Board/MCPCB/Aluminum Based PCB

1. Aluminium base material,
2. 1oz copper, Board thickness 1.2mm
3. Excellent quality with competitive price

1. 1 Layer Aluminium base material pcb board
2. 1oz copper, Board Thickness 1.2mm
3. Excellent quality with competitive price

4. Application for led bulb lamp

5. Certificate: ROHS, UL, ISO9001-2000, ISO14001

6. led pcb assembly for led lighting.

Our Manufacturing Capability for PCB Board

items	technical index
Product model	al substrate cu substrate
material thermal conductivity	1.0/m.k, 1.5/m.k, 2.0/m.k, 3.0/m.k
thermal impedance	0.85 °C/W – 0.4 °C/W
al base material type	1060 / 5050 / 5052
surface disposal	HASL/ OSP/ immersion gold/ immersion tin/ immersion silver
layer	Single-side al substrate / double-side al substrate /four-layer al substrte
maximum measurement	1200mm*460mm
minimum measurement	5mm*5mm
line width/space	0.1mm
warp and twist	≤0.5%(thickness:1.6mm, measurement:300mm×300mm)
processing thickness	0.3-5.0mm
copper foil thickness	35um 70um 105um 140um
molding dimension tolerance	±0.15mm
v-cut positioning accuracy	±0.1mm
aperture location deviation	±0.076mm
scope of molding dimension tolerance	cnc:±0.1mm punching:±0.15mm
breakdown voltage	3KV - 5KV
peel strength	≥1.4N/mm

	Quickly	Sample(Normal)	Mass(Normal)
Single-sided:	1-2 days	3-5 days	7-8 days
Double-sided:	2-3 days	5-8 days	8-10 days
4 Layers:	3-4 days	8-10 days	10-12 days
6 Layers:	5-6 days	10-12 days	12-14 days
8 Layers:	6-8 days	10-12 days	14-16 days
10 Layers:	8-10 days	12-14 days	16-18 days
12 Layers:	10 days	14-16 days	16-18 days
>14 Layers:	>=10 days	>=16 days	>=16 days

Note:Specially Board Regards document specific request

U.S.UL product ceftification，PCB E354170 PCB;
ISO 90012008
ISO/TS 16949
QuaIity assurance standards lPC-A-600 HlPC-6011l PC-6012 BlPC-D-300 ANSl-UL-796
AnaIysis CapabiIity
In-House(Lab)
Follow the lPC-TM-650 for test function Follow the lPC-TM-650 for test function
PeeIable strength test for copper foil
Metal thickness
Flash Gold sliding pad roughness test
Solder Mask Gloss Level test
Cross section
SoIderability & Thermal shock test
Lead-free reflow simulation test(up to 280C）
Additional test can be tested at GF
authorized lab